The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.
Ultra-fine micro-hole processing series
Features and Advantages:
Ultra-fine micro-hole machining has many advantages such as high precision, high roundness, and good finish.
Tungsten steel, ceramic wire nozzle and glue nozzle, laser solder ball welding nozzle, etc.
Scan the QR code to read on your phone
We could not find any corresponding parameters, please add them to the properties table