PRODUCT
PRODUCT
Product Details
Ultra-fine micro-hole processing series
Application Field:
The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.
Features Advantages:
Ultra-fine micro-hole machining has many advantages such as high precision, high roundness, and good finish.
Application object:
Tungsten steel, ceramic wire nozzle and glue nozzle, laser solder ball welding nozzle, etc.
Product Description
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Tel：0755-29962978 0755-29962358
Address: 6F, Building 3B, Qiaode Science Park, Kelian Road, Guangming District, Shenzhen , Guangdong
E-mail：cqsxff@126.com
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