Products

PRODUCT

Product Details

Ultra-fine micro-hole processing series

Application Field:

The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.

Features Advantages:

Ultra-fine micro-hole machining has many advantages such as high precision, high roundness, and good finish.

Application object:

Tungsten steel, ceramic wire nozzle and glue nozzle, laser solder ball welding nozzle, etc.

Product Description

Parameters

 

We could not find any corresponding parameters, please add them to the properties table

Next

Next Page