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Welding head/pulse hot pressing welding head series
Welding head/pulse hot pressing welding head series
Welding head/pulse hot pressing welding head series
Welding head/pulse hot pressing welding head series
Welding head/pulse hot pressing welding head series
Welding head/pulse hot pressing welding head series
Welding head/pulse hot pressing welding head series
Welding head/pulse hot pressing welding head series
Welding head/pulse hot pressing welding head series
Welding head/pulse hot pressing welding head series
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Ultrafine precision hole series

Ultrafine precision hole series

Ultra-fine micro-hole processing series

The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.
Ultra-fine micro-hole processing series
Ultra-fine micro-hole processing series

The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.
Ultra-fine micro-hole processing series
Ultra-fine micro-hole processing series

The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.
Ultra-fine micro-hole processing series
Ultra-fine micro-hole processing series

The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.
Ultra-fine micro-hole processing series
Ultra-fine micro-hole processing series

The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.
Ultra-fine micro-hole processing series
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