PRODUCT
PRODUCT
Product Details
Ultra-fine micro-hole processing series
Application Field:
The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.
Features Advantages:
Ultra-fine micro-hole machining has many advantages such as high precision, high roundness, and good finish.
Application object:
Tungsten steel, ceramic line nozzle and glue nozzle, laser solder ball welding nozzle, etc.
Product Description
Parameters
We could not find any corresponding parameters, please add them to the properties table
Previous Page
Next Page
Tel：0755-29962978 0755-29962358
Address: 6F, Building 3B, Qiaode Science Park, Kelian Road, Guangming District, Shenzhen , Guangdong
E-mail：cqsxff@126.com
Consult now
No public
