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Ultra-fine micro-hole processing series
Ultra-fine micro-hole processing series

Ultra-fine micro-hole processing series

Application Field:

The products are mainly used in wire bonding needles used in the wire bonding process of semiconductor aluminum wires and gold wires in the microelectronics field, and non-contact tungsten steel nozzles used in laser solder ball welding equipment.

Features Advantages:

Ultra-fine micro-hole machining has many advantages such as high precision, high roundness, and good finish.

Application object:

Tungsten steel, ceramic line nozzle and glue nozzle, laser solder ball welding nozzle, etc.

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